Tin wire is a necessary electronic auxiliary material for welding in the electronics industry. Due to the different operation methods, tin wire production process, and the ratio of manufacturers, some undesirable phenomena such as poor diffusion force and sharpening will occur during the welding process of tin wire. The reasons for this phenomenon are summarized as follows:

1. Fundamentals of Welding Work 1 Purpose of welding operation: (1) Mechanical connection: the function of connecting two metals with tin wire to fix them. (2) Electrical connection, the function of connecting two metal connections with tin wire to make electrical conduction. This electrical connection is characteristic of soldering operations and cannot be achieved by adhesives.

Electrolytic solder wire is divided into lead solder wire and lead-free solder wire. The main components of lead solder wire are lead and tin, and the eutectic point of tin-lead alloy is 6337, which means that the content of tin (sn) is 63%. , the lead (pb) content is 37%, the eutectic temperature is 183 degrees, the crystal grains of the crystal structure are very fine, and are not easily affected by the environment, so that the reliability of the PCBA is guaranteed, a

Precautions for tin bar soldering operation: 1. The correct soldering method can not only save time, but also prevent air pollution. 2. Solder is used for connecting parts and electrical conduction and heat dissipation, not as a support point for force.

Generally speaking, the melting point of solder wire with less lead should be increased by at least 20-45 ℃ according to the difference in composition. As a result, the temperature setting of the soldering iron tip must be increased accordingly. As the temperature increases, the volatilization rate of the flux also increases, and the flux is a key factor that determines the metal activity (fluidity) after the solder wire is melted. If the temperature is too high, the flux volatilizes too quickly, which will directly cause insufficient fluidity of tin, resulting in defects such as tin tips, tin bridges or wire drawing, which seriously affect the soldering effect.

Solder wire is an indispensable electronic accessory in the post-soldering process, and PCB refers to a printed circuit board, which is the provider of electrical connections for electronic components. Call it a "PCB board". The process of tinning on the circuit board includes immersion tin, printed reflow oven, and one is machine soldering machine welding or manual soldering iron welding. No matter which process is used, the PCB board after soldering will be more or less. For some solder or solder slag, cleaning solder and solder slag are different.

The implementation of lead-free processes in the electronic product manufacturing industry faces the following problems: 1) Lead-free soldering(solder wire, solder bar); 2) Lead-free of components and PCB boards; 3) Lead-free soldering equipment

The use of lead-free tin wire soldering materials will have a serious impact on the tin wire soldering process. Therefore, in developing a lead-free soldering process, all relevant aspects of the soldering process must be optimized. 1. Selection of appropriate materials and methods In lead-free tin wire soldering processes, the selection of soldering materials is the most challenging. The selected materials should be proven in their own research, or recommended by authoritative institutions or literature, or have been used experience. These materials are tabulated for testing in process trials to study them in depth to understand their impact on various aspects of the process.

After purchasing tin wire, you must understand the use and precautions of tin wire, because it allows you to use tin wire safely for welding and avoid accidents. Precautions: 1. Safety in the work area Personal protective equipment must meet workplace safety regulations Beware of solder scalding, beware of being scalded by splashed solution-state solder. Wear protective clothing to avoid burns. Protect your eyes by wearing protective shields. When using adhesives during soldering or desoldering, pay particular attention to the adhesive manufacturer's warnings.

As many companies have begun to face the process challenges of lead-free soldering, manual soldering and related technologies have been recognized as a key factor in manufacturing and require more research and development. Manual tin wire soldering generally occurs at the end of the production line. At this time, the PCB board already has a high intrinsic value.